Liquid cooling manifold layout in direct-to-chip systems

The manifold as a physical interface map

A liquid-cooling manifold organizes repeated supply and return paths between the larger loop and branch circuits. A buildable package makes branch pitch, valve orientation, connector choice, end-port access, mounting, cleaning, labeling and the test protocol visible before fabrication starts.

Details to confirm

• Header size, overall length, branch count and pitch

• Valve, quick connector, clamp, flange, thread and sealing requirements

• Mounting position, service clearance and hose bend space

• Pressure, medium, temperature, hold criteria, cleaning and protected packing

Keep the boundary explicit

The manifold is not the complete cooling system. Customers or integrators define the architecture, CDU, cold plates, controls and acceptance criteria. Chelsey fabricates the confirmed stainless hardware from released drawings, BOMs, samples or interface requirements.